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Zero Ion Ionic Contamination Tester

Zero Ion Ionic Contamination Tester

New Equipment | Cleaning Equipment

Zero Ion Ionic Contamination Tester Today's Zero Ion is designed to meet the cleanliness testing challenges associated with modern circuit assemblies. The Zero Ion is capable of extracting and quantifying assembly contamination levels per IPC J STD0

Aqueous Technologies Corporation

Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBA

Technical Library | 2023-04-17 21:17:59.0

The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.

Jabil Circuit, Inc.

The Relationship Between Cleanliness and Reliability/Durability

Technical Library | 2023-04-17 21:25:52.0

Outline/Agenda * Introduction of Ionics and ROSE * Evolution in technology * Rev H in the IPC-J-STD-001 * Real World Case Study * Conclusions

KYZEN Corporation

Thermally Conductive Adhesives

Thermally Conductive Adhesives

New Equipment | Materials

For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resistance. Interfacial resistance is a signifi

Zymet, Inc

Whisker Formation Induced by Component and Assembly Ionic Contamination

Technical Library | 2023-02-13 18:56:42.0

This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.

Celestica Corporation

Validity of the IPC R.O.S.E. Method 2.3.25 Researched

Technical Library | 2010-06-10 21:01:48.0

This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.

KYZEN Corporation

Material Lab Technician

Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support

Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin

Winslow Automation (aka Six Sigma)

Quality Inspector

Career Center | Milpitas, California USA | Production,Quality Control

Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking an experienced, detail-oriented, quality-conscious team player for our Quality Assur

Winslow Automation (aka Six Sigma)

IONOX® FCR - High Strength Semi-Aqueous Electronics Cleaner

IONOX® FCR - High Strength Semi-Aqueous Electronics Cleaner

New Equipment | Cleaning Agents

IONOX® FCR is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. Easy to use, FCR is applied as received. A water rinse is required to remove all traces of soils and cleaner residues

KYZEN Corporation

Characterization, Prevention and Removal of Particulate Matter on Printed Circuit Boards

Technical Library | 2016-12-22 16:44:04.0

Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH) of the particulate matter. In wet condition, particulate matter can electrically bridge closely spaced features on printed circuit boards (PCBs), leading to their electrical failure. (...) The objective of this paper is to develop and describe a practical, routine means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.

IBM Corporation


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