BEST Inc master instructor Norman Mier demonstrates how to replate gold fingers using the BEST gold contact replating kit. In this video he demonstrates how to repair, prepare and replate the finger using a gold replating solution. If you want to lea
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Cleaning Equipment
CM11 , CM 22, CM33. CM60 – Ionic Contamination and Cleanliness Test Systems to MIL & DEF standards.
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi
Suppliers of Stencil/PCB Cleaners, Soldering Systems, Solder Paste Inspection & Measurement Systems, Ionic Contamination Test Systems, Spray Fluxers and Cleaning Chemicals
Manufacturer of Precision Cleaning Systems for Industrial and Electronic Applications. Inline Aqueous & Semi-Aqueous Cleaners , Batch Cleaners, Distillable Vapor Cleaners and Strip Cleaners as well as Water Treatment & Ionic Contamination Systems.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Used SMT Equipment | Board Cleaners
Austin American Technology's Mega II cleaners are designed for high reliability, environmentally-friendly, solvent-based cleaning and testing applications. These closed-loop, solvent regenerative systems feature quantitative ionic contamination detec
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