Super powerful expanding desiccant to keep boards & microelectronics moisture free.... Much different than Silica Sand Beads. Also supplier of corrosion prevention treatments that are alternatives to Conformal coatings.
TREK INDUSTRIES is a recognized leader in cleaning equipment for the most demanding applications. This experience in controlled process and precision cleaning has become valuable in working with many critical cleaning applications such as printed ci
TREK INDUSTRIES is a recognized leader in cleaning equipment for the most demanding applications. This experience in controlled process and precision cleaning has become valuable in working with many critical cleaning applications such as printed ci
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
New Equipment | Test Equipment
For over 40 years the Benchmark for Ionic Contamination Testing Commonly referred to "Cleanliness Testing" as this test method has, for over 40 years, been acknowledged as an important Quality Assurance and Process Control tool in the manufacture of
Industry News | 2003-06-04 09:11:10.0
Concoat Systems has further expanded and enhanced its CM range of contamination testers (or contaminometers).
Technical Library | 2010-06-10 21:01:48.0
This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.
New Equipment | Test Equipment
Localized Electronics Cleanliness Tester and Residue Extractor The information gathered when using the C3 is intended to provide a measure of the cleanliness of a localized region of a circuit board. In addition, the C3 extracts a sample of the effl
New Equipment | Selective Soldering
Selective Soldering System-H Specifications: MODEL HPS 4/46 HPS 4/35S Equipment parameters Dimension（L×W×H) 2450x1845x1565 (mm) 2450 x 2055 x 1665 (mm)
