Electronics Forum | Tue Jun 12 18:06:17 EDT 2001 | davef
The criterion you use will depend on the test method you select. For minimum requirements, look at J-STD-001C, Para 8, "Cleanliness Requirements". I figure that you�d measure the residues on a lot of your current product, measure the res on a lot o
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
