Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
) 20 000 CPH IPC 9850 chip tact time (3) 0.163 s IPC 9850 chip repeatability 3 (X, Y, Theta) (3) 30 μm, 1.8° (6) 45 μm, 1.8° IPC 9850 chip accuracy @ Cpk = 1.33 (X, Y, Theta) (5) 50 μm, 2.6° (6) 75 μm, 2.6
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
