ZESTRON proudly offers SIR testing at our Manassas, VA location. SIR is a quantitative test method used to characterize the PCB manufacturing process residues and their impact on reliability. ZESTRON’s SIR testing capability is offered to clients who
Industry News | 2013-01-14 14:49:54.0
Sono-Tek Corporation (OTC BB: SOTK)will showcase its SonoFlux Servo Dual Flux ultrasonic spray fluxing system in booth #3400 at the upcoming IPC APEX EXPO
Events Calendar | Wed May 10 00:00:00 EDT 2017 - Wed May 10 00:00:00 EDT 2017 | Itasca, Illinois USA
Kester to Host Technical Rework Seminar
New Equipment | Solder Materials
AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N
New Equipment | Cleaning Equipment
World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz
Technical Library | 2020-10-27 02:02:17.0
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is "when should we switch from Type 3 to a smaller solder powder?" Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented. The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.
Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
Industry News | 2010-03-27 18:19:25.0
Milton, NY - Sono-Tek Corporation, the world leader in the development and application of ultrasonic spray fluxing systems and ultrasonic coating machines, will feature the SonoFlux EZ Ultrasonic Reciprocating Spray Fluxing System in booth 1783 at the upcoming IPC/APEX conference and exhibition.
Industry Directory | Distributor / Manufacturer
AllPoint Electronics is specialized in SMT, PTH, and TEST Equipment and services for electronics industry in Brazilian market. We provide full support for PCB assembly factory implementation, and process consulting
Career Center | Norcross, Georgia USA | Production
Solder Technician Reports to: Supervisor Responsibilities: 1) Melts and applies solder along adjoining edges of workpieces to solder joints, using soldering iron, gas torch, or electric-ultrasonic equipment. 2) Grinds, cuts, buffs, or bends edge
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
