New Equipment | Education/Training
Get Ahead... Smart decisions and top-notch quality are critical to success — particularly in the highly competitive, ever-changing electronic interconnection industry. Training alone may help with your quality initiatives, but when key employees act
Industry News | 2015-11-04 20:46:46.0
FSInspection today announced that it will provide the X-Mag Machine Vision Station in the Hand Soldering Competition presented by IPC — Association Connecting Electronics Industries® in cooperation with productronica 2015. Skilled competitors will demonstrate their soldering skills on Nov. 10–13 in Hall A2, stand 405, as they compete for cash prizes: 1st place — €300; 2nd place — €200; 3rd place — €100; and a coveted spot at the IPC Hand Soldering World Championship at IPC APEX EXPO® in Las Vegas, Nevada on March 15-17, 2016.
Industry News | 2013-01-17 11:06:48.0
Juki Automation Systems, Inc. today announced its product lineup to be exhibited in Booth #513 at the upcoming IPC APEX EXPO
Electronics Forum | Wed Feb 12 16:48:31 EST 2014 | gmcquoid
We are having an internal debate here related to minimum Conductor Width. Can you have your QA manager review this and advise. IPC-6012C-2010 3.5.1 Conductor Width and Thickness When not specified on the master drawing the minimum conductor width s
Electronics Forum | Thu Jan 12 22:29:10 EST 2023 | rgduval
So, as I understand it, IPC6012 are performance criteria that your board shop should be using. I think you'd want to be using IPC600 for acceptance criteria at incoming inspection. At least, that's what I always did in my CM days. And, since you'r
Electronics Forum | Mon Jun 14 14:39:12 EDT 2004 | davef
HASL Thickness: * HADCO DFM manual specifies a nominal thickness of 50-1500uin with an option for 100-1000uin * Merix DFM manual specifies 30-200uin IPC-6012, Class 1, 2, 3 do not spec a HASL thickness at all but only require that full coverage is m
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Fri Aug 15 00:51:30 EDT 2008 | boardhouse
Hi Paul, My discloser, I sell for an offshore house, this is Crap.... Section 3.4.3 Annular Ring (External) of IPC-6012A, which also calls out Table 3-5, states that "Plated-through holes identified as vias can have up to 90 degrees breakout of t
Electronics Forum | Mon Jun 04 10:40:37 EDT 2012 | davef
I'm not aware of any such stipulation about witness [probe] marks for assembled boards, per se. Certainly, witness marks should not affect the intended performance of the assembly, you know, like damaging the solder connection or smudging solder mate
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
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