Electronics Forum | Mon Jun 04 10:40:37 EDT 2012 | davef
I'm not aware of any such stipulation about witness [probe] marks for assembled boards, per se. Certainly, witness marks should not affect the intended performance of the assembly, you know, like damaging the solder connection or smudging solder mate
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Tue Nov 11 17:35:08 EST 2008 | davef
SM-840, is a material qualification document only, with all the test requirements applicable only to a defined test coupon, not to production boards. So, it's useless for what you're trying to accomplish. As assemblers use A-610 - Acceptability Of E
Electronics Forum | Sun Nov 30 08:53:15 EST 2003 | davef
IPC-6012A finds "circuit repairs" as acceptable in Class 1, 2, and 3 only "As agreed by user and supplier." So, it is your call, basically. Generally these repairs, if done properly, are reliable. See IPC-7721, 5.2.3, for conductor repair by welding
Electronics Forum | Thu Jan 09 15:19:41 EST 2014 | davef
For a typical wear surface application [millions of wipes], I agree with hege. You need to be talking electrolytic gold, NOT immersion gold. IPC-2221 says something like ... For edge connectors and areas not to be soldered: * Nickel - 2.5um [~100uin]
Electronics Forum | Fri Jun 02 14:42:06 EDT 2023 | tommy_magyar
"If for example a customer requested assemblies but never specified their requirements, would MFGs be expected/required to follow parameters from a specific class related to the end use of said product?" Answer: The customer placed an order with you
Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter
> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.
Electronics Forum | Tue Sep 16 15:47:17 EDT 2003 | davef
First and most important, it doesn't matter dip who is down-wind of the rendering plant. The customer said, "I want bla bla bla." The supplier said, "I want to supply to the customer's order for bla bla bla and will deliver to that specification on
Electronics Forum | Wed Jan 17 18:08:51 EST 2007 | John S.
We use a fairly simple system. IPC put out standards 7912A and 9261A to define opportunities. Basicly the "number of components" + "number of solder joints" = "number of opportunities." Some six sigma benchmarking studies indicated "Sigma Level" =
Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon
Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha
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