Industry News | 2013-02-15 18:09:04.0
Carlsbad, CA – February 15, 2013: Machine Vision Products (MVP), a leader in Automated Optical Inspection will be demonstrating an expanded applications toolbox as well as introducing new AOI technologies at the IPC APEX EXPO 2013 in San Diego from February 19 to 21.
Parts & Supplies | Solder Paste Mixers
12 2-693-981-01 ..... -.... (UNST6-30) BOLT (UNST6-30), STOPPER 4 UNST6-30 13 2-693-982-01 ........ -..- MAKC1008A ABSORBER (MAKC1008A), SHOCK 4 MAKC1008A 14 2-693-982-11 ........ -..- MAKC1008B ABSORBER (MAKC1008B), SHOCK 4 MAK
Industry News | 2020-08-28 02:51:20.0
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announces that Phoenix, AZ-based Outroar LLC launched new EMS PCB assembly services under the name Titan Circuits using BTU equipment.
Industry News | 2018-10-02 17:16:16.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming iMAPS 2018 – Pasadena 51st International Symposium on Microelectronics exhibition and conference, scheduled to take place October 9-11, 2018 at the Pasadena Convention Center in California.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-01-24 21:20:30.0
Essemtec today announced plans to exhibit in Booth #3525 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing. With different modules, the system can grow synchronously with customer requirements for performance and processes. The company also will demonstrate the compact Spider jet dispenser and two FOX² systems – one with the solder paste Jet valve and one with the micro screw valve.
Industry News | 2022-02-10 17:05:35.0
The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporation's Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
Industry News | 2012-01-21 16:28:10.0
Nihon Superior will introduce the newest addition to its SN100C lead-free solder series in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
Industry News | 2010-03-27 17:37:02.0
TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will feature its leading machinery in booth 407 at the upcoming IPC/APEX conference and exhibition.
IPC is the trade association for the printed wiring board and electronics assembly industries.
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