Electronics Forum | Tue Mar 17 08:20:59 EDT 2009 | scottp
I work for one of the largest automotive suppliers. Our Workmanship Standards pre-date IPC-610 but they are nearly identical in regards to solder balls. We supply to all the major OEMs, including the Japanese, and I don't recall our solder ball sta
Electronics Forum | Fri Aug 28 05:26:05 EDT 2009 | sachu_70
Hi Dave, Would this be different from IPC-610-D. I am not sure.
Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Thu Apr 12 01:35:13 EDT 2007 | Haris
IPC-A-610D is a Acceptability of the Electronic assemblies so all your questions depends on the product classes either 1,2,or 3 and it is given in this standard about the acceptablity criteria of the soldering of any type of the components i.e. it h
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Mon Aug 29 13:05:11 EDT 2005 | solderguy
Hi All, In IPC-A-610 there is a definition for what constitutes "Entrapped/encapsulated/attached" on page 5-14 in the note. It says that it means that the ball will not be dislodged in the normal service environment of the product. Jim Jenkins
Electronics Forum | Fri Aug 25 14:39:24 EDT 2006 | davef
1 When you peel the solder connection of a BGA, * If solder remains on the soldered surface [eg, component, substrate, etc], it's good. * If some solder remains and some base metal is present, it's marginal. * If no solder remains, it's NG. 2 Try I
Electronics Forum | Mon Jun 11 10:41:16 EDT 2001 | techment
Can someone helps to interpret the IPC-A-610's requirement on solder balls ( less than 5 mils in diameters.). We found about 6 to 10 balls ( less than 5 mils ) scattered in a 600 sq mm board. Is it consider failing for class 2 product ?. Thank you.
Electronics Forum | Wed Aug 12 00:16:43 EDT 1998 | Ron Costa
Hello everyone, I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible solde
Electronics Forum | Thu Feb 10 11:40:25 EST 2005 | Carol
Hello All, Can somebody direct me to a facility or school or even a business that can offer an x-ray course for Class 3 electronic circuit board population interpretation, as in BGA ball acceptance, connector solderability fill acceptance etc.? Some
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