Electronics Forum | Thu Jan 31 10:20:04 EST 2013 | rjohnston58
Need your help with a referee call on solder balls. See attached pictures. Engineering believes the solder balls and splash in pictures violate IPC-A-610E-2010 section 5.2.7.1. Purchasing on the other hand believes these are acceptable. Info: balls a
Electronics Forum | Wed Apr 11 08:36:23 EDT 2007 | davef
IPC-A-610D refers to 'toe down configuration' several times, beyond the 8.2.5.6 that you question. Although none will add to your understanding of 'toe down'. A lead that is 'toe down' is one where the foot of the lead is not parallel to the pad. T
Electronics Forum | Thu Apr 12 08:16:19 EDT 2007 | davef
Toe down solution: * Land pattern design * Solder stencil design * Proper component fabrication Normal gull wing lead solder requirement: Solder must extend to the mid-point of the outside of the lead bend.
Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar
Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr
Electronics Forum | Sun Nov 10 15:36:06 EST 2013 | davef
Assuming your conformal coating material was selected with the intent of living a life in contact with oil, why doesn't your coating meet the IPC-A-610D requirement of that there be no voiding, no breaks in the surface, no loss of adhesion, etc? Furt
Electronics Forum | Tue Apr 04 10:08:33 EDT 2000 | Russ
Neil, IPC 610 has the criteria for solder balls re. quantity and size per sq./in. These are acheivable requirements but no-clean is not necessarily a drop in process. You need to review stencil /pad /component design to ensure that "midship" solde
Electronics Forum | Wed Jun 07 09:26:09 EDT 2006 | amol_kane
can you also please tell us the section in IPC-610?...is this in RevD? also, does this also give the solder volume for BGAs? Thanks, Amol
Electronics Forum | Thu Oct 12 13:15:37 EDT 2017 | davef
It is the two conditions pictured in IPC-A-610F, Figure 5-1 C, D. In the old, simplier days, we wanted our solder connection to have: * Low wetting angle * Shiny metal Today, the metal doesn't have to be shiny and the wetting angle can be a high
Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT
I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT
Electronics Forum | Wed Mar 08 18:09:52 EST 2006 | jax
Part is most likely a QFN package. IPC-610-D has standards on solder quality for this new type of package.
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