Electronics Forum | Wed Jan 31 17:45:37 EST 2001 | dason_c
Hi! William, please check the new IPC-A-610 Rev C, para 12.4.10 for the soldeirng anomalies. Most of them may consider as process indicator and not the defect. The most common method to elimate the solder ball is to reduce the solder volume by red
Electronics Forum | Fri Jun 29 14:13:05 EDT 2001 | markhoch
Just a quick thought on solder balls "or beads" caused when using NC paste. I found a spec (12.4.10 in IPC-A-610C) that says solder beads are acceptable if they are entrapped in NC flux residue and can not be dislodged in the normal service environme
Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury
| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s
Electronics Forum | Tue Feb 21 20:14:50 EST 2006 | Joseph
Dear all, Recently our lead-free samples being rejected due to very dull and sometimes grainy and very porous surface on solder joints. This samples was flow thru' the lead-free wave soldering with SN100C alloy composition. Referring IPC-A-610 D, le
Electronics Forum | Fri Oct 17 16:31:53 EDT 2014 | dyoungquist
Per IPC-A-610D: Target is 100% vertical fill but 75% vertical fill is acceptable for Class 1,2,3. Only needing 75% fill of the barrel when soldering plate through on an 0.093" thick board with our selective solder has been a life saver at times.
Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.
Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T
Electronics Forum | Wed May 09 13:37:07 EDT 2007 | jmills
Greetings Tried to search past threads without an answer. I have a resistor that just fits the between pads. Some of the resisitor were installed without the termnation sitting on the pad and are infact sitting on solder a good .020 to .025 above th
Electronics Forum | Thu May 01 12:28:56 EDT 2008 | petergog
what is the main concern about this reqirement? Why IPC-A-610c is revsised to this? IPC-A-610c said it is a defect.Solder touches the body of a plastic bodied component, eg SOICs and SOTs. But D version think it is acceptable. WHY? I thought "plasti
Electronics Forum | Tue May 02 16:37:57 EDT 2006 | bhall
I have experienced the exact same problem with excess solder touching the plastic component body. The solution in my case was simply to replace the stencil. I was using a reusable stencil frame that had been worn out. I replaced the stencil with a so
Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70
Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d
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