Full Site - : ipc 610 d solder ball (Page 31 of 49)

QFN's and LGA's

Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis

QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in

Re: S.P.O.T.T.

Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc

Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs

Re: Via-in-pad

Electronics Forum | Tue Jan 25 21:59:44 EST 2000 | Dave F

Michael: On reliabiliity, consider that: � IPC-SM-782, "Surface Mount Design And Land Pattern Standard" and IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies" specifically describe via in pads as "poor des

Re: bowtwist

Electronics Forum | Wed Jul 21 20:52:52 EDT 1999 | Scott

| | I have pcb's in which i am experiencing warping. | | the boards are 12.8125" on a diagonal measurement. | | they are out approximatley .010". | | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what i

Re: bowtwist

Electronics Forum | Thu Jul 22 06:54:45 EDT 1999 | Earl Moon

| | | I have pcb's in which i am experiencing warping. | | | the boards are 12.8125" on a diagonal measurement. | | | they are out approximatley .010". | | | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,an

Kester 985M - Will It Help?

Electronics Forum | Sat Nov 23 12:39:18 EST 2013 | joeherz

We installed a Soltec Delta 3 a few months ago and have been trying to run with a VOC free no clean. We're using SN100C in the pot. We are spraying the material and have top/bottom preheat. Evaporation of the water in the flux is a bit of a stru

Crazing or Delam - Thermal or Mechanical?

Electronics Forum | Wed Jun 17 16:02:09 EDT 2009 | mhunter

Any thoughts on this will be appreciated, thanks in advance for reviewing. This assembly has been processed in our facility by going through a press operation (~ 1731 lbs), then into wave solder. Note the discoloration around the pemnut. The discol

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 00:01:47 EST 2007 | Muhammad Haris

Hi, The distance between the two terminations/endings/pads of 0603 (0201)is 0.15mm i.e. lesser than than the distance between the 0603 and through hole i.e. 0.5mm My ques is that, then why its termination doesnot short as it has a minimum distance.A

SMT component handling

Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef

IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3

Electrical Test problem

Electronics Forum | Thu Jan 18 17:26:30 EST 2018 | davef

I'm aware of no electrical test for detecting voids and air bubbles. If someone was x-raying my boards and saw voids and air bubbles and they weren't happy about it, first thing I'd do is convince them that the boards a within standard. You know some


ipc 610 d solder ball searches for Companies, Equipment, Machines, Suppliers & Information

Association Connecting Electronics Industries (IPC)
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