SIGMA Link is a powerful web-based software suite currently structured around 3 modules: SIGMA Import | SIGMA Review | SIGMA Analysis SIGMA Link is a continuous yield improvement tool to translate SPI and AOI inspection data into useful process inf
New Equipment | Test Equipment
Localized Electronics Cleanliness Tester and Residue Extractor The information gathered when using the C3 is intended to provide a measure of the cleanliness of a localized region of a circuit board. In addition, the C3 extracts a sample of the effl
Electronics Forum | Tue Jun 24 21:09:58 EDT 2008 | mleber
Machine operator. Correlation through quality and IPC JSTD trainers.
Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT
I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT
Industry News | 2013-04-19 19:11:56.0
IPC – Association Connecting Electronics Industries® recently launched a certification program that allows printed board manufacturers to demonstrate a commitment and ability to protect customers’ intellectual property and comply with industry best practices.
Industry News | 2008-10-12 22:46:32.0
BEDFORD, NH � October 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, now offers capability measurement analysis of leaded devices.
CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
Technical Library | 2014-08-19 15:39:13.0
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come.
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual
SMTnet Express, July 13, 2017, Subscribers: 30,584, Companies: 10,624, Users: 23,496 Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements K. Tellefsen, M. Holtzer, T. Cucu, M. Liberatore, M. Schmidt - Alpha
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/surface-modification?con=t&page=5
… IPC APEX Expo 2021 Nordson MARCH Come see Nordson MARCH at IPC APEX EXPO 2021 SMTA Michigan Expo & Tech Forum 2016 Nordson MARCH Nordson MARCH presenting on "Introduction to the Benefits of Employing Plasma Treatment Prior to Conformal Coating in Today's Advanced Board Assembly Environment" CARMA
40731 | https://www.smta.org/icehet/ICEHET-2020-Program.pdf
Surface Mount Technology Association (SMTA)
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
