Full Site - : ipc gold embritllement (Page 20 of 40)

Re: Black spots on gold finish pads.

Electronics Forum | Tue Dec 01 07:24:44 EST 1998 | Earl Moon

| Hi folks , | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection

Re: Black spots on gold finish pads.

Electronics Forum | Tue Dec 01 07:54:49 EST 1998 | kallol chakraborty

| | Hi folks , | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspec

Re: Black spots on gold finish pads.

Electronics Forum | Tue Dec 01 09:02:18 EST 1998 | Earl Moon

| | | Hi folks , | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our in

Re: Black spots on gold finish pads.

Electronics Forum | Fri Dec 04 20:26:34 EST 1998 | kallol Chakraborty

| | | | Hi folks , | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Ou

Re: Black spots on gold finish pads.

Electronics Forum | Fri Dec 04 20:37:45 EST 1998 | kallol chakraborty

| | | | | Hi folks , | | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most

IPC-4552A Immersion Gold Thickness Recommendations

Electronics Forum | Wed May 05 06:19:41 EDT 2021 | jineshjpr

Hi Anyone having IPC 4552 A ?? Can You please provide the details of Immersion Gold Thickness Recommendations mentioned in Page 21 & Additional details required for Immersion Gold Thicker Than Specification by Design mentioned in page 23.

Solder On Gold Mounting Holes, Gold Pressure Fit Socket Lands

Electronics Forum | Tue May 06 15:33:36 EDT 2008 | operator

I know IPC-A-610 RevD has requirements for Gold Fingers and solder contamination. Is there any such requirements for Gold Mounting Holes, Gold Pressure Fit Socket Lands (SMT pads), Exposed Gold Traces ? Wouldn't these all be considered "critical cont

IPC 4552 A ENIG Au Thickness Recommendation

Electronics Forum | Tue May 11 08:20:52 EDT 2021 | jineshjpr

Hi Anyone having IPC 4552 A ?? Can You please provide the details of Immersion Gold Thickness Recommendations mentioned in Page 21 & Additional details required for Immersion Gold Thicker Than Specification by Design mentioned in page 23.

Gold finger burnishing

Electronics Forum | Tue Apr 27 12:33:37 EDT 2021 | SMTA-64304163

We have some circuit boards with some burnishing on the gold fingers from beveling. Does not go through the gold but is cosmetically noticeable. Is this a defect? Is it rejectable or cosmetic? Can someone tell me where the IPC deals with this? I ha

Immersion Gold

Electronics Forum | Thu Sep 30 10:30:11 EDT 1999 | Chris May

I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. What is the best way to achieve


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