1229 ipc gold embritllement results

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Tape residue cleaner

Electronics Forum | Fri Apr 07 11:52:44 EDT 2000 | Ashok Dhawan

Can anyone suggest a cleaning solvent for removing silicon residue after K Tape has gone through 2 cycles of reflow soldering ? The solvent or cleaning method has to be compliant to IPC Standards - to be used for cleaning gold edge fingers - PCB asse

Gold coated spring contacts

Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef

Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.

PCB Au thickness

Electronics Forum | Tue Oct 07 02:18:13 EDT 2003 | iman

Hi Experts, Pls help advise what is the expected range of PCB gold thickness over Ni (for ENIG/Electrolytic fabrication processes)? any referrence standards set by the IPC?

Gold thickness

Electronics Forum | Fri Jul 11 02:42:40 EDT 2008 | aj

Thanks Dave, IPC-6012 states min at 0.05um. Has this been a update or is it for a different class? thanks, aj...

ENIG

Electronics Forum | Thu Jan 22 05:29:25 EST 2009 | johanhuizing

I think IPC-4552 is define the thickness of Nickel as: 3 to 6�m and Gold as: 0,05�m minimum

Solder wicking up on connector leads

Electronics Forum | Tue Sep 16 17:03:34 EDT 2014 | rangarajd

We have an issue with solder wicking up the leads/ inside terminations on an SMT connector. The solder coverage is sometimes over 50% of the connectors inside pin length. The terminations are gold plated. Is there an IPC spec for acceptability? Plea

ENIG

Electronics Forum | Thu Jan 22 20:14:44 EST 2009 | herman

If you wish to specify ENIG, your best method of doing it is to simply invoke IPC-4552 (or IPC-4553 for immersion silver) on the fabrication drawing. These IPC standards define ENIG and IAg, and I believe they specify 150-180 uinches of nickel covere

Gold Leaded SMT devices

Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef

The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu

Re: Immersion Gold

Electronics Forum | Fri Oct 01 04:03:31 EDT 1999 | Brian

| I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | What is the best way to achi

Solder Balls

Electronics Forum | Wed Aug 12 00:16:43 EDT 1998 | Ron Costa

Hello everyone, I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible solde