Electronics Forum | Fri May 28 13:03:14 EDT 2021 | cbart
I'm honestly not sure IPC addresses this? the one thing i would ask myself if it were my issue: is the effected area in the critical contact area of the finger/contact? in other words if its low on the finger where the bevel was applied i bet its not
Electronics Forum | Thu Sep 30 13:37:08 EDT 1999 | Dave F
| | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | What is the best way to
Electronics Forum | Wed Aug 22 22:22:52 EDT 2001 | davef
First an administrative point, you can edit the postings that you make on SMTnet. Look for the yellowish-greenish EDIT button at the top of your posting. Second there are over 170 postings on intermetallic* on the fine SMTnet Production Forum Archi
Electronics Forum | Thu Sep 03 12:36:11 EDT 1998 | davef
| We have an unusual problem here and I'm reaching for more input if anyone can help??? We are an OEM manufacturer of PCA's. After a history of consistent quality designs, we have one small memory SIMM that is causing major headaches for us and our P
Electronics Forum | Wed May 30 17:49:49 EDT 2001 | davef
You are correct. IPC wants you to pay for that standard, regardless if you get a hard copy or download it. Generally, it�s pretty boring stuff for production types. [Although, you will recognize some of the goofy things your designers have done to
Electronics Forum | Tue Feb 26 10:55:58 EST 2002 | davef
This could be an electroless nickel / immersion gold specification. While the symmetry of the numbers is pleasing to the eye, but as Joyce Marchand says, "It doesn't blow-up my skirts." Problems with your specification are: * Lower end of the gold
Electronics Forum | Tue Aug 19 09:23:18 EDT 2003 | caldon
FUJI DUDE- You can purchase a Kit from IPC for verifying machine acceptability. IPC-9850 full kit with Components and boards, and such will set you back around $26,250 (member price). Just the glass board alone will cost you $3,800 (member Price).Thi
Electronics Forum | Wed Apr 04 08:57:13 EDT 2001 | Cal
IPC-TM-650 is a works well. Ionic conductivity is a good rule of thumb but I prefer ION Chromatography this will help determine the residues left behind from the fab process. There are a bunch of ways to determine solderabiltiy- Wet Balance and SERA
Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc
Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos
Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
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