Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef
The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the
Electronics Forum | Thu Sep 27 10:53:59 EDT 2007 | gregoryyork
Joris, > > Yep, very common to have those small > blow holes in lead-free alloys. We used to get > them very consistently on white-tin finished > boards, and less frequently with gold finished > boards, for what ever that is worth. > > IPC-6
Electronics Forum | Sat Oct 07 04:02:50 EDT 2000 | C.J. Long
Good morning, All: I am from PCB shop and one of our customer is experiencing solder bridge on 16 mil pitch QFP( immersion gold finish). Land width requirement is 8 +/- 1 mil measured over top of of land and our mean is 7 mil. Bottom land width is 8
Electronics Forum | Thu Apr 16 14:09:04 EDT 1998 | Lou Madge
Dear Collegue, A seminar tittled "Things that you should know before selecting an alternative surface finish" will be offered on Friday, April 24 (during the week of the Nepcon East show) in Philadelphia. Topic that will be discussed include: Evalua
Electronics Forum | Thu Apr 16 14:07:49 EDT 1998 | Lou Madge
Dear Collegue, A seminar tittled "Things that you should know before selecting an alternative surface finish" will be offered on Friday, April 24 (during the week of the Nepcon East show) in Philadelphia. Topic that will be discussed include: Evalua
Electronics Forum | Mon Oct 13 12:28:11 EDT 2003 | Andrea
Up until this point, my company has been hand soldering all of our assemblies. We are a high reliability manufacturer and work to the IPC-610 Class three/ target. We just received a Reflow Solder Batch Oven. It is a small oven, a Gold-Flow GF-B. I ha
Electronics Forum | Sun Nov 30 08:53:15 EST 2003 | davef
IPC-6012A finds "circuit repairs" as acceptable in Class 1, 2, and 3 only "As agreed by user and supplier." So, it is your call, basically. Generally these repairs, if done properly, are reliable. See IPC-7721, 5.2.3, for conductor repair by welding
Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury
| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s
Electronics Forum | Wed Jun 30 11:09:24 EDT 1999 | John Thorup
| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.
Electronics Forum | Thu Jul 01 16:43:52 EDT 1999 | Dave F
| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.
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