Electronics Forum | Thu Aug 28 23:15:44 EDT 2014 | phyllishwl
Hi all, Our production reported that they found 3 panels out of 53 panels with strange phenomenon after reflow. 1/ Blister / Delamination of PCB panels, 2pcs blister/delamination under solder mask, 1pc under Gold plating at Gold finger 2/ Silkscr
Electronics Forum | Fri Oct 01 05:03:28 EDT 1999 | Wolfgang Busko
| | | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | | What is the best way
Electronics Forum | Thu Dec 28 20:56:08 EST 2000 | Dave F
This is not a real demanding job. We've talked about materials sources before, check the fine SMTnet Archives. Responding to your question, try: Circuit Repair Rowley,MA 508-948-7973 [Jeff Ferry is a contributor to SMTnet, so ya gotta go there fir
Electronics Forum | Fri Mar 23 11:58:01 EST 2001 | mparker
You are mixing long exposed paste back into fresh? How long has your fresh jar been open to the air? You are probably doing yourself a disservice by scavenging the paste (it could have moisture entrapped). Your visocity has definitely changed. You a
Electronics Forum | Sat Mar 24 00:50:24 EST 2001 | PeteC
Fresh paste from a factory sealed container. Should paste be scrapped out altogether if left on the stencil for too long (length-of-time?)? Our paste is Multicore CR39. Multicore reccomended the print chamber be around 22C @ 50%-60% RH. Our plant is
Electronics Forum | Mon Dec 13 09:43:28 EST 1999 | Chris May
As Wolfang says about slightly bent legs, handling is of the essence. Are these devices decanted into another tray for your machine. It may be worthwhile doing a "movement" chart for these components. Do not explain why or when you are doing it beca
Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon
| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is
Electronics Forum | Sun Jul 06 10:07:03 EDT 2003 | MA/NY DDave
Hi Sam, Great answers so far. Let me take a stab at a few of your questions. Q1. whether this is named Pososity? I can't tell from your description. Several companies and the IPC have porosity tests to see if the Gold has good coverage of the und
Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter
Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became
Electronics Forum | Wed Sep 22 15:33:54 EDT 2010 | davef
Comments are: * First, no one is looking at your posting. You need to post in the 'SMTnet Production Forum' [top of the page]. This 'SMTnet Site Support Forum' is for whiners that want to complain to Neil about problems in logging-in, font that's to
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