Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
Electronics Forum | Sat Dec 22 01:34:26 EST 2018 | sara_pcb
My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product. 1. Is there any long term reliability issues with 2% Ag in BGA Ball. 2. If the PCB finish
Electronics Forum | Tue Sep 25 17:42:11 EDT 2007 | gsala
your comments will be appreciated, please; IC tests have been performed on two kind of Raw PCBs (HASL) samples by adopting three different methods : First Sample (supllier A) - Omegameter 600 SMT, solvent=40�C: extratcing time 10 min result = 0.2
Electronics Forum | Thu Dec 16 11:54:45 EST 1999 | Mike Naddra
At reflow an inert atmosphere is used to mitigate the occurance of oxidation, to me the decision weather to move from an inert atmosphere is based on several things ; PCB surface finish - are you using a HASL finish, OSP or another surface finish and
Electronics Forum | Fri Nov 11 08:30:12 EST 2005 | GS
HI all, which is the last "though" about the max Pb % allowed/acceptable into a Pb Free Alloy ? For istance inside : - HASL Process Solder Pot Alloy - Wave Solder Pot Alloy ( 400Kg mass average) - Static Wave Solder Pot Alloy - Etc IPC-J-
Electronics Forum | Mon Jul 31 10:51:11 EDT 2006 | Chunks
OK so you're stuck with gold. Not all that bad unless you're paying for it. Gold is very flat compared to HASL, so you should have no problems printing. This should lead to good placement as well. But after oven you mat have a big contrast betwee
Electronics Forum | Thu Dec 06 19:46:08 EST 2001 | davef
First, we�re assuming that we�re talking hot air solder leveled [HASL] bare boards, eh? Consider using A-600 - Acceptability of Printed Boards as the basis for discussing the bare board problems. It is the bare board analog of A-610 - Acceptability
Electronics Forum | Wed May 27 21:05:30 EDT 1998 | Steve Gregory
Hey yooze guys! Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any posts f
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Thu Sep 03 12:36:11 EDT 1998 | davef
| We have an unusual problem here and I'm reaching for more input if anyone can help??? We are an OEM manufacturer of PCA's. After a history of consistent quality designs, we have one small memory SIMM that is causing major headaches for us and our P
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
