Electronics Forum | Wed Jan 24 11:27:54 EST 2007 | bradlanger
We have been using SN100C lead free hasl for over a year now with good success. It is very solderable and has good shelf life. You do have to make sure the finish gets applied to the correct thickness. If the lead free hasl finish is not applied thic
Electronics Forum | Fri Oct 14 13:12:30 EDT 2005 | Mika
Thanks Patrick, I our mixed standard HASL/RoHS production area; our customer have choosen Ni/Au plating for their RoHS boards. What You are saying (3.); is that we should be more attentive on the quality of the pcb manufactory. Even if our customer
Electronics Forum | Wed May 03 16:37:10 EDT 2017 | charliedci
I don't believe there should be any issues with the HASL finish. The issue is how long on the shelf and is a bake out required to remove moisture from PCB, as in any FR4 PCB's that may have had time to absorb moisture.
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Tue May 31 10:44:16 EDT 2005 | Scott B
We have found that when the HASL thickness is less than 5 microns the tin in the HASL reacts with the copper leaving a SnCu surface with poor solderability and microscopic grainy Pb islands. The IPC does not specify minimum HASL thickness but we now
Electronics Forum | Wed Apr 16 19:23:52 EDT 2008 | molos21
I think you are close to the problem when you expect the pcb having a problem. When I look at your different pics I saw that your via holes looks like this pcb has a hasl finish... and when i look at Q 14 this picture tells me that the pcb is not an
Electronics Forum | Sat Dec 22 01:34:26 EST 2018 | sara_pcb
My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product. 1. Is there any long term reliability issues with 2% Ag in BGA Ball. 2. If the PCB finish
Electronics Forum | Mon May 15 12:36:12 EDT 2017 | edhare
I don't believe there should be any issues with > the HASL finish. The issue is how long on the > shelf and is a bake out required to remove > moisture from PCB, as in any FR4 PCB's that may > have had time to absorb moisture. > I don't believe
Electronics Forum | Thu Dec 16 11:54:45 EST 1999 | Mike Naddra
At reflow an inert atmosphere is used to mitigate the occurance of oxidation, to me the decision weather to move from an inert atmosphere is based on several things ; PCB surface finish - are you using a HASL finish, OSP or another surface finish and
Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
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