Industry News | 2016-02-17 17:17:13.0
Nordson DAGE and MatriX Technologies, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #1845 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Attendees are encouraged to make an appointment now and bring a sample to the stand. The Nordson DAGE Ruby and Diamond FP MXI (Manual X-ray Inspection) and MatriX Technologies new X3# AXI (Automated X-ray Inspection) systems will be showcased.
Industry News | 2014-02-20 19:43:43.0
Scienscope International will showcase their X-Scope X-Ray Inspection Systems at this year's IPC APEX Expo. Live demonstrations of their X-Scope 1800, X-Scope 2000 and X-Scope 6000 machines will be held in booth #2335.
Industry News | 2009-03-02 00:10:24.0
TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.
Electronics Forum | Mon Jul 29 09:27:15 EDT 2013 | charliedci
All of our reflow is with room air, 63/37 and SAC305. I believe nitrogen will get you better looking solder joints (shiny, less grainy under magnification), but per IPC, functionality and strength I don't think there is much difference.
Electronics Forum | Tue Oct 26 15:44:35 EDT 2004 | Paul_pmd
Hi Mike, Surface mount components arn't difficult to work with at all. They have pretty much the same tolorance to heat degridation as Dip packages. I suggest two Irons when working with two pole resistors and caps. Heating only one end at a time wil
Electronics Forum | Fri May 27 17:21:35 EDT 2005 | mrclean
Dear SM Rookies, Another acceptable test method is visual inspection. IPC-A-610 details what to look for with different contaminants, providing magnified pictures of the possible visual residues. With an existing cleaning process, magnification
Electronics Forum | Tue Oct 22 15:32:09 EDT 2002 | ruppertg125
We are a military contractor and need to build to IPC610 class3. We are receiving many parts with palladium leads and currently use a No-clean solder paste. We have evaluated OA pastes with very little improvements. Without a touch up of all leads th
Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane
I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of
Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F
| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
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