Full Site - : ipc solder mask pad (Page 13 of 142)

Lite Fast SR-1000

Lite Fast SR-1000

New Equipment |  

Lite Fast SR-1000, a UV Solder Mask, was designed to screen print over conductive traces, landing pads, resistors, fuses and capacitors on Printed Circuit Boards (PCBs) and ceramic substrates. Other applications include metal and various plastics.

MLT/Micro-Lite Technology

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

New Equipment | Prototyping

Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture

Heros Electronics (Shenzhen) Co., Ltd.

Caring Circuit Tech Limited

Industry Directory | Manufacturer

Caring Circuit specialises in the supply of prototype, small and medium-series PCBs factory in Shenzhen,China.We are a leading provider of custom Single layer,double layer,multilayer rigid PCBs.

Pad Cratering Susceptibility Testing with Acoustic Emission

Technical Library | 2015-08-13 15:52:40.0

Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.

Agilent Technologies, Inc.

FREE Webinar: Eliminate Circuit Board Problems and Failure Modes

Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA

FREE Webinar: Eliminate Circuit Board Problems and Failure Modes

Vision Engineering Inc.

SIPAD Systems, Inc.

SIPAD Systems, Inc.

Videos

SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi

SIPAD Systems Inc.

Auto-SIR  Surface Insulation Resistance Test

Auto-SIR Surface Insulation Resistance Test

New Equipment | Test Equipment

Auto-SIR – Performs Surface Insulation Resistance testing in accordance with all major international standards: IEC 61189-5, ISO 9455-17, IPC-TM-650, BELCORE GR-78-CORE, DIN German & JIS Japanese standards.  Includes elements of ANSI/IPC-JSTD001C (as

Ascentech LLC

Chimall pcb1

Chimall pcb1

Parts & Supplies | Circuit Board Assembly Products

PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic

PULANG TECHNOLOGY CO,.LTD

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

Technical Library | 2012-10-18 21:58:51.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.

Agilent Technologies, Inc.


ipc solder mask pad searches for Companies, Equipment, Machines, Suppliers & Information