Industry News | 2012-10-16 19:02:05.0
The Surface Mount Technology Association of Edina, MN and IPC — Association Connecting Electronics Industries® announced today the co-location of the SMTA International Conference and Exhibition (SMTA International) and the IPC fall standards development committee meetings in Fort Worth, Texas, October 12-18, 2013.
Industry News | 2012-04-03 13:02:23.0
BANNOCKBURN, Ill., USA, April 3, 2012 — IPC — Association Connecting Electronics Industries® announced the Japanese language release of the E revision of IPC-A-610, 電子組立品の許容基準. IPC’s most widely-used standard.
Industry News | 2019-06-26 19:59:58.0
IPC’s Emerging Engineer program provides professionals early in their careers an opportunity to learn from industry mentors about IPC Standards development, and to obtain education and training for professional development. IPC is now actively seeking applications for engineers and mentors for the 2020 Emerging Engineer program.
Industry News | 2011-02-26 18:06:10.0
The Capital Chapter is pleased to announce the upcoming SMTA meeting at EIT, Inc., 108 Carpenter Drive, Sterling, VA 20164 on March 29, 2011 from 4pm-8pm.
Industry News | 2012-07-12 16:39:49.0
— IPC — Association Connecting Electronics Industries® has released IPC-1758, Declaration Requirements for Shipping, Pack and Packing Materials.
Industry News | 2013-10-15 18:26:54.0
IPC – Association Connecting Electronics Industries® awarded the first IPC J-STD-004 Qualified Products Listing (QPL) certificate to Indium Corporation’s Clinton, N.Y., USA facility.
Industry News | 2012-10-19 15:36:48.0
The SMTA and IPC announced the co-location of the SMTA International Conference and Exhibition (SMTA International) and the IPC fall standards development committee meetings in Fort Worth, Texas, October 12 - 18, 2013 and beyond.
Industry News | 2014-03-20 13:36:17.0
IPC’s Validation Services Program has awarded the first IPC J-STD-001/IPC-A-610 Qualified Manufacturers Listing (QML) to IEC Electronics Corporation’s Newark, New York and Albuquerque, New Mexico, facilities.
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
Industry News | 2024-04-15 11:05:25.0
IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2024. The Peter Sarmanian Corporate Recognition Award was presented to Summit Interconnect and the Stan Plzak Corporate Recognition Award was presented to Robert Bosch GmbH.
IPC is the trade association for the printed wiring board and electronics assembly industries.
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