Industry News | 2010-12-03 21:35:04.0
Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.
Industry News | 2018-06-04 18:04:26.0
IPC's Validation Services Program is proud to announce Alternative Manufacturing Inc.’s (AMI) IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) recertification. AMI is an electronics contract manufacturing company based in Winthrop, Maine and provides PCB assembly, wire harness production, and product assembly for a variety of industries. To earn recertification of the QML, AMI successfully completed an intensive audit based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2017-05-15 15:41:33.0
IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Jhubei, Hsinchu County, Taiwan. TUC provides mass lamination services, copper clad laminates and prepregs to the global electronics industry. To earn the QPL, TUC successfully completed an intensive audit based on IPC's foremost standard on base materials for laminates and prepregs: IPC 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Industry News | 2015-03-19 17:09:34.0
IPC's Validation Services Program has awarded an IPC J-STD-001, IPC-A-610, and IPC J-STD-001 Space Addendum Qualified Manufacturers Listing (QML) to STI Electronics, Inc. (STI), an electronics manufacturer and IPC Training Center based in Madison, Ala.
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
Industry News | 2022-02-07 17:16:04.0
IPC presented its highest corporate honors to two IPC member companies, Apple Inc., and MacDermid Alpha Electronic Solutions during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2022. The Peter Sarmanian Corporate Recognition Award was presented to MacDermid Alpha Electronics Solutions, and the Stan Plzak Corporate Recognition Award was presented to Apple, Inc.
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Industry News | 2009-04-15 23:13:35.0
BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� is pleased to honor Uyemura International Corp. and Phoenix International with the Peter Sarmanian and Stan Plzak Corporate Recognition Awards respectively. These awards are bestowed in recognition of their steadfast support of IPC and significant contributions of time and expertise to standards development and other vital IPC activities. The companies were recognized during the IPC Annual Meeting and Luncheon, March 31, 2009 in Las Vegas.
Industry News | 2023-11-20 15:17:13.0
Industry group reports five-year growth in electronics workforce programs as it celebrates National Apprenticeship Week
Industry News | 2013-02-26 16:39:34.0
IPC awarded the IPC Peter Sarmanian Corporate Recognition Award to Lockheed Martin and the IPC Stan Plzak Corporate Recognition Award to Intel Corporation.
IPC is the trade association for the printed wiring board and electronics assembly industries.
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