Industry Directory | Manufacturer
Professional in turnkey PCBA service for PCB manufacture, PCB assembly and components sourcing. PCB passed ISO, TS16949, UL, CE and RoHS. PCBA compliant ISO9001 and IPC-A-610E. And components are all new & original.
New Equipment | Test Equipment
The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution o
Vantage™ S22 Plus is a cost-effective solution that delivers top-of-the-line AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT / PTH environments. DPIX™ 3-D Technology
Electronics Forum | Sun Aug 24 08:57:56 EDT 2008 | davef
For an nate measurement method, look here http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.22c.pdf For bare boards, look to IPC-6012, par. 3.4.4 For assemblies, look to IPC-A-610
Electronics Forum | Mon Feb 02 16:42:03 EST 2004 | davef
Bow & twist for bare boards and panels: IPC-A-610 1.5% for PTH only and 0.75% for SMT. So, what are you doing to these poor boards to make them warp?
Used SMT Equipment | Pick and Place/Feeders
Type Pick and Place machineDimension off-line (L x W x H) 2150 x 1700 x 1500 mm (+500 mm for signal light)Dimension in-line (L x W x H) 1750 x 1300 x 1500 mm (+500 mm for signal light)Board thickness min. 0.5 mm - max. 4.5 mm thickBoard size min. 30
Industry News | 2019-09-18 16:03:56.0
IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.
Industry News | 2013-09-26 18:03:10.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.
Technical Library | 2014-08-19 15:39:13.0
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come.
Technical Library | 2013-01-31 18:43:15.0
There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices, the emergence of lead-free processing, and changes in device form factors. Warpage measurement has become a key measurement for analysis; prevention and prediction of interconnect defects and has been employed in failure analysis labs and production sites worldwide. First published in the 2012 IPC APEX EXPO technical conference proceedings
Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine
The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3?), height repeatability (below 2µm at 3?), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg. http://www.sakiglobal.com/automated-optical-i
Career Center | Mayaguez, Puerto Rico | Engineering,Production
Detail oriented and goes to great lengths to insure that the products are meeting and exceeding customer expectations. Place procedures and training in place to provide former company with techniques for ISO 9001:2008 and QS 9000. Assist design engi
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
SMTnet Express, October 3, 2019, Subscribers: 32,260, Companies: 10,890, Users: 25,178 Effects of Temperature Uniformity on Package Warpage Credits: Akrometrix Knowing how package warpage changes over temperature is a critical variable in order
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
) profiles of - 40/125 °C and 0/100 °C in single zone chambers. Testing was performed in accordance with IPC-9701 guidelines using daisy chained components and test boards to allow in situ resistance monitoring of the solder joints during testing
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
– MY300SX PLACEMENT SPEED AND ACCURACY SYSTEM FEATURES PLACEMENT SPEED AND ACCURACY – MY300SX-11/15 Rated speed (1) 24 000 CPH IPC 9850 chip net throughput (2, 3
IPC is the trade association for the printed wiring board and electronics assembly industries.
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