Parts & Supplies | Circuit Board Assembly Products
Specifications 1.One-stop OEM pcb assembly service. 2.ROHS, SGS, UL certificated 3.Reasonable price 4.High Quality 5.Fast Delivery PCB Assembly&PCBA Service 1. Experienced components sourcing team specially for scarce parts 2.1 to 12 layers m
Parts & Supplies | Circuit Board Assembly Products
Specifications 1.One-stop OEM pcb assembly service. 2.ROHS, SGS, UL certificated 3.Reasonable price 4.High Quality 5.Fast Delivery PCB Assembly&PCBA Service 1. Experienced components sourcing team specially for scarce parts 2.1 to 12 layers m
Parts & Supplies | Circuit Board Assembly Products
Specifications 1.One-stop OEM pcb assembly service. 2.ROHS, SGS, UL certificated 3.Reasonable price 4.High Quality 5.Fast Delivery PCB Assembly&PCBA Service 1. Experienced components sourcing team specially for scarce parts 2.1 to 12 layers m
Parts & Supplies | Circuit Board Assembly Products
Specifications 1.One-stop OEM pcb assembly service. 2.ROHS, SGS, UL certificated 3.Reasonable price 4.High Quality 5.Fast Delivery PCB Assembly&PCBA Service 1. Experienced components sourcing team specially for scarce parts 2.1 to 12 layers m
Parts & Supplies | Circuit Board Assembly Products
Specifications 1.One-stop OEM pcb assembly service. 2.ROHS, SGS, UL certificated 3.Reasonable price 4.High Quality 5.Fast Delivery PCB Assembly&PCBA Service 1. Experienced components sourcing team specially for scarce parts 2.1 to 12 layers m
Up to 20 layers, 4 mil traces / spaces, 6 mil drilled holes and Book-bind capability. MIL-P-50884 approved for adhesiveless materials. Deliveries down to 3 days are available.
Capabilities include: Up to 30 layers, 3 mil traces and spaces, 6 mil drilled holes, available in 24 hours to 2 weeks.
Capabilities include: 1 to 20 layers, adhesive based or adhesiveless, 3 mil traces and spaces, 6 mil drilled holes, available in 3 days to 20 days
Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
min trace width/space 3 mils, min hole diameter 0.15mm