Layer: 12 Material: FR4(Tg170) Board thickness: 1.6mm Min trace width/spacing: 4/4mil Min hole size: 0.2mm Impedance control
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
Industry Directory | Manufacturer
Juivtmall is a PCB manufacture, produce normal PCB, FPC and HDI As for 2-layer, default property, the lead time will be 1 day. Ability of produce: Layer: 2-64 layers Min drill: 0.1mm Min trace/spacing: 1.57mil 2+N+2, 3+N+3......
Up to 30 layers, down to 3 mil traces / spaces, 6 mil drilled holes. MIL-P-55110 approved for FR-4, polyimide, PTFE, epoxy Thermount(tm). Copper Sealed Vias are available. Deliveries down to 24 hours are available.
eavy copper board Material FR-4 Layers : 2 Trace width/space : 10 mil/10 mil Copper thickness 5/5 oz Application : High Voltage power Supply
Heavy copper PCB/ Power supply PCB Layer: 4 Material: FR4(Tg170) Finished copper thiness:4oz on each layer Min. trace width/spacing: 0.3/0.4mm(12/16mil) Application: Power controls, heat dissipation
New Equipment | Assembly Services
4 layer PCB Material: Rogers 5880 Finished Thickness :2.0 mm; Copper thickness : 1OZ finished ; Surface finishing: Immersion Tin Min Via hole size :0.30mm; Min Trace width/ spacing : 0.13 mm / 0.13 mm
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In accordance with Spec information such as layer count, trace width, trace spacing, drill size and business information such as due date, shipping method, place of delivery, the system will search the manufacturers who are most suitable to produce t
Technical Library | 2021-06-21 19:34:02.0
In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.
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