Used SMT Equipment | In-Circuit Testers
Yokogawa AQ6370 OPTICAL SPECTRUM ANALYZER. The AQ6370 uses a double-pass monochromator structure to achieve high wavelength resolution (0.02 nm) and wide close-in dynamic range (70 dB). Thus, closely allocated signals and noise can be separately
Used SMT Equipment | In-Circuit Testers
Yokogawa AQ6370 OPTICAL SPECTRUM ANALYZER. The AQ6370 uses a double-pass monochromator structure to achieve high wavelength resolution (0.02 nm) and wide close-in dynamic range (70 dB). Thus, closely allocated signals and noise can be separately
Used SMT Equipment | In-Circuit Testers
Yokogawa AQ6370 OPTICAL SPECTRUM ANALYZER. The AQ6370 uses a double-pass monochromator structure to achieve high wavelength resolution (0.02 nm) and wide close-in dynamic range (70 dB). Thus, closely allocated signals and noise can be separately
Technical Library | 2015-08-20 15:18:38.0
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices. Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results.
New Equipment | Fabrication Services
PCB Manufacturing Capabilities Items Fabrication Capabilities Remarks Layer Count 2-28 layers If your PCB order is over 28layers, please contact your customer service for quotation. Material FR-4 94V0/ Alum
In the world of makers, people enjoy the fun of designing and developing hardware/ software, even final electronic products. They will not concentrate a lot on the cost and manufacturability. But it is quite different from lab to factory, when it com
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New Equipment | Fabrication Services
High-density integration (HDI) technology enables the miniaturization of end product design while meeting higher standards of electronic performance and efficiency. Eastech has been focusing on high precision circuit board, continuously investing in
New Equipment | Assembly Services
High Frequency PCB Material: SYTECH Layer Count: 4 layers PCB Thickness: 1.6mm Min. Trace / Space Outer: 0.1mm/0.1mm Min. Drilled Hole: 0.2mm Via Process: Tenting Vias Surface Finish: ENIG+OSP Product Features 1. DK needs to be tiny as well
Supplier: Shenzhen Grande Electronic Layers: 4 Application: General Industrial Equipment PCB Prototype/ China HASL PCB Manufacturer PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: HASL Testing: 100% E-test Package: Vacuum packing Lead
Supplier: Shenzhen Grande Electronics Layers: 4 Application: Stone Crusher PCB Prototype and Manufacturing Process | Grande PCB & PCBA PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing L
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