New Equipment | Assembly Services
The board is designed by customer and it's for Network interface controller. We did one-stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly). Product name: 4 Layer PCBA board Material: FR-4 TG170 Thicknss: 1
New Equipment | Assembly Services
The board is designed by customer and we did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 4 Layer PCBA board Material: FR-4 TG170 Thicknss: 1.6mm Surface: HASL Solder mask: Green
New Equipment | Cable & Wire Harness Equipment
Compact, Stand-Alone Pulse-Heat Pulse Heat System The SMR features a Pulse Heat power output which provides controlled temperature ramp-up to reflow temperatures, reducing thermal shock risk and unwanted heating of adjacent solder joints. The syste
New Equipment | Assembly Services
NextPCB has specialized in PCB Prototype and PCB Manufacturing for 15 years. In order to offer the best service and competitive price to our customers, we have PCB Prototype manufacturer and PCB Manufacturing Manufacturer dedicated to each PCB fabric
New Equipment | Board Handling - Storage
The ISM400 Stronghold has been developed to support the storage needs of the most varied types of components. Capable of supporting up to 480 configurable positions, the ISM400 Stronghold can take 7/13/15" reels, JEDEC trays, MST and PTH tubes, scree
Industry Directory | Consultant / Service Provider / Manufacturer
Tropical Stencil is dedicated to providing the highest quality Laser Cut Stencils; with our rapid response, you will have your Stencil delivered on-time.
Industry Directory | Manufacturer
Asia Pacific Circuits is one of Asia's leading Electronic Manufacturing Services companies, committed to providing high quality PCB and PCBA Contract Electronics Manufacturing Services.
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
JUKI Automation Systems at the IPC Apex 2015; showcasing Intelligent Storage Systems.
JUKI Automation Systems at the IPC Apex 2015; showcasing Intelligent Storage Systems.