Electronics Forum | Tue Oct 22 20:37:09 EDT 2002 | davef
Pd takes longer to desolve than the materials yer used to using. Search the fine SMTnet Archives for background on modifying your reflow recipe.
Electronics Forum | Fri Mar 19 09:48:02 EST 2004 | Patticake
I have a similar question. What are the major differences between J-std-001 and IPC 610 class 3 ?
Electronics Forum | Mon May 24 20:58:15 EDT 2004 | davef
Consider: * Looking at: http://training.ipc.org/ * Searching with 'google' on 'ipc 610 training' * Having your suppliers train your inspectors, by including your people in the suppliers' on-going training and certification of their staff
Electronics Forum | Thu Mar 03 11:00:04 EST 2005 | PeteP
In a nutshell, what are the Rev D changes to the standards? What re-certification requirements are in place?
Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT
I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT
Electronics Forum | Mon Jul 18 09:43:31 EDT 2005 | norrin_radd
Aside from a visual first article to IPC 610, what inspection criteria do people put in place post wave solder (pre clean)? Thank you
Electronics Forum | Wed Mar 08 18:09:52 EST 2006 | jax
Part is most likely a QFN package. IPC-610-D has standards on solder quality for this new type of package.
Electronics Forum | Wed Jun 07 09:26:09 EDT 2006 | amol_kane
can you also please tell us the section in IPC-610?...is this in RevD? also, does this also give the solder volume for BGAs? Thanks, Amol
Electronics Forum | Mon Sep 25 11:43:56 EDT 2006 | mrduckmann2000
HELP, I AM SEEKING THE PROPER CANDLE POWER FOR A SHOP FLOOR THAT IS WORKING TO IPC-610 CLASS II AND III STANDARDS. ANYONE KNOW WHAT THE MIN AND MAX SHOULD BE??? THANKS FOR THE HELP!
Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas
IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D
