Full Site - : ipc-610 (Page 21 of 36)

Pin In Paste IPC Guidelines

Electronics Forum | Wed Jan 03 15:57:38 EST 2007 | realchunks

Is there a seperate guideline for Pin In Paste process in IPC? I have IPC610 year 2000 rev C (I know rev D is out). Or do most people use the thruough hole part of the Guideline as their criteria?

finger print

Electronics Forum | Thu Jan 04 13:12:22 EST 2007 | russ

do not touch copper boards, use cotton gloves. IPC 610 has some handling guidelines that you may want to look at. Russ

Solder Joint

Electronics Forum | Tue Jan 30 13:50:59 EST 2007 | slthomas

Your customer needs to be beaten sensible with a copy of IPC-610. Strapping it to a 2x4 may increase efficiency.

baking PWB standard??

Electronics Forum | Tue Aug 26 03:48:44 EDT 2008 | eyalg

Does anyone know if the IPC 610 standard call for baking bare boards (PWB) prior assembly? Note: I am talking about bare boars only and NOT plastic packages components, Regards. Eyal Green

TSOP lead deformation (help)

Electronics Forum | Mon Jan 26 11:18:10 EST 2009 | evtimov

It seems like your parts are acceptable regarding IPC610. I would't bother if all in the specs. But the question is why you damage your partss in P&P process. I think you should avoid that instead of looking for standards. Regards, Emil

Solder Ball Criteria

Electronics Forum | Tue Mar 17 08:20:59 EDT 2009 | scottp

I work for one of the largest automotive suppliers. Our Workmanship Standards pre-date IPC-610 but they are nearly identical in regards to solder balls. We supply to all the major OEMs, including the Japanese, and I don't recall our solder ball sta

Socket in wave soldering

Electronics Forum | Mon Mar 01 11:56:51 EST 2010 | pjc

Your IPC-610 workmanship manual will have the answer for you (I don't have the latest at my fingertips). Depends on what class you are building too, 1, 2 or 3 and the application of this connector on the product- which you must determine.

BGA Voids

Electronics Forum | Thu May 20 21:16:46 EDT 2010 | erli

Hi Pat According IPC-610D voids biger 25% are considered defects. You need verify you Pre Heat and try to reduce the ramp. Its very importante verify if the BGA`s are avoid hummity. Erli

Radial capacitor placement

Electronics Forum | Sat Jun 19 17:05:25 EDT 2010 | bob2000

Thanks for sharing your work experience. I found a reference material with IPC standard (IPC 610) that specifies an exact heigth that a capacitor needs to be placed, I will check this standard specifications in more depth.

MQFP soldering issues - how can I improve?

Electronics Forum | Fri Aug 19 07:40:24 EDT 2011 | scottp

What do the heel fillets look like and what level of IPC-610 (class 1,2, or 3) are you working to? Do the joints on all 4 sides look bad or just the one side? Do other parts on the board look OK?


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