Full Site - : ipc-610 (Page 23 of 36)

Lifted pad / Trace on PCB rework

Electronics Forum | Mon Jul 20 09:10:20 EDT 2020 | spoiltforchoice

I'll be honest here, while training people to IPC standards is good. Zero% of our clients or future business inquiries ask about things like IPC610, even stipulating ISO is rare, as long as there are systems in place of some sort.

Requirements/standards for component shifting

Electronics Forum | Mon Aug 31 13:29:26 EDT 2020 | dwl

What exactly do you mean by component shifting? If you mean lead over hang, i.e, how far off the pad can a component lead sit and still be acceptable, IPC 610 addresses this.

Ferrite Core cracks

Electronics Forum | Thu Apr 01 20:07:06 EDT 2021 | smith88

Is there a standard that gives criteria for cracks in Ferrite Cores? I have reviewed Jstd-oo1 G and IPC 610 G and do not see a specific reference to Ferrites. Thanks for your help

Re: Soldering to thru-hole lead to ground plane without thermal relief

Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.

IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet

Soldering PTH Card stiffeners

Electronics Forum | Tue Aug 13 09:47:49 EDT 2002 | johnw

Hi Folk's, a quick and easy? question. Got a card with PTH edge stiffeners fitted to it so we need to flow solder them. Having problems getting hole fill, mainly I think due to 2 things, poor pin to hole ratio and also a bit of oxide. The question i

Palladium leaded devices IPC610 class3 acceptable

Electronics Forum | Tue Oct 22 15:32:09 EDT 2002 | ruppertg125

We are a military contractor and need to build to IPC610 class3. We are receiving many parts with palladium leads and currently use a No-clean solder paste. We have evaluated OA pastes with very little improvements. Without a touch up of all leads th

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Thu Oct 26 11:49:54 EDT 2006 | sms_don

CW, The good news is that you are not trying to use SAC paste with SnPb balls for that would be a void generator due to the ball being liquidous while the SAC paste is still in a flux cleaning stage. Two points to consider: One, voids are not an i

Solder Joint

Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.

Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T

RF surface mount assembly

Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau

RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have

Re: SMT component placement

Electronics Forum | Thu Feb 04 21:17:41 EST 1999 | Chris G.

| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | IPC states: 50% off pad for class 1 and 2 25% off


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