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PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

Videos

Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an

PACE Worldwide

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

Videos

Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an

PACE Worldwide

MPI Realizes Outstanding Benefits from ViTrox’s V810 Standard AXI System

Industry News | 2015-08-11 13:31:16.0

“The ViTrox V810 system has proven to be quite capable in its intended mission, helping us produce defect-free product for IPC610, Class III customers in the Defense, Aerospace, Industrial Computing and Medical market sectors. The machine is very reliable and we really appreciate the outstanding support from the ViTrox team for training, upgrades and technical information.” Dane Wentworth, Senior Vice President, MPI

ViTrox Technologies

Ersa to Offer Demos in Interactive Virtual Showrooms during APEX Virtual EXPO

Industry News | 2021-02-12 16:18:20.0

Kurtz Ersa Inc. today announced plans to participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Ersa has upgraded its demo/application centers to interactive virtual showrooms where the team will give customers in depth and personalized equipment demonstrations for wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more. The company will highlight the EXOS 10/26, Ersa VERSAEYE and and HR 600 XL during the virtual event.

kurtz ersa Corporation

PDR's New Affordable PCB X-ray Inspection Systems Offer Quality Image Clarity

Industry News | 2020-06-07 04:44:33.0

PDR X-ray Solutions is pleased to announce that its 2D and 2D+ X-ray systems have set a new industry standard for high-quality X-ray images at an affordable price. Choosing the correct system for your requirements such as X-ray for quality control or X-ray for process control is vital for the success of both X-ray circuit board inspection programs as well as X-ray semiconductor inspection programs.

PDR-America

Koh Young Technology is Showing its Award-winning Suite of True 3D Inspection Solutions at NEPCON China

Industry News | 2021-04-21 10:17:09.0

Seoul, South Korea – At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.

Koh Young America, Inc.

Koh Young Technology is Showing its Award-winning Suite of True 3D Inspection Solutions at NEPCON China

Industry News | 2021-04-29 16:58:08.0

At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.

Koh Young America, Inc.

SMT Book – Surface Mount Technology Book PDF

Industry News | 2018-12-08 03:15:55.0

SMT Book – Surface Mount Technology Book PDF

Flason Electronic Co.,limited

SMT Book – Surface Mount Technology Book PDF

Industry News | 2018-12-08 03:17:14.0

SMT Book – Surface Mount Technology Book PDF

Flason Electronic Co.,limited

solder balls

Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve

The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac


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