Training Courses | ON DEMAND | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Electronics Forum | Sun Feb 12 22:52:20 EST 2017 | ltchsze
Hi fellow professionals, Wondering whether anyone has experience with solder splashing from component terminal. Have identified the source using the component without printing solder paste on PCB. Wondering the root-cause of the solder splashing fr
Electronics Forum | Mon Feb 13 10:41:14 EST 2017 | dyoungquist
Could be that your temperature ramp up rate is too fast. This could cause the flux in the solder paste to burn off too rapidly. When that happens, it can expand as it heats up and burns off, causing the solder to get spread out from the pad.
Electronics Forum | Tue Feb 21 16:39:03 EST 2017 | ltchsze
Thanks for input, dyoungquist. The condition here is without any flux or paste applied. Solder from component terminal started splashing by itself when put through re-flow.
Electronics Forum | Wed Mar 22 14:59:20 EDT 2017 | solderingpro
Hello Henry, I believe some further clarification may be needed for someone to assist. Is the component already soldered prior to reflow? Does the component have paste already applied going through reflow? (or as per my previous question, is it al
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Wed Jun 23 13:34:29 EDT 2004 | df_indy
I am four weeks into my new job, there always seems to be some issues here with PCB every week. Today while I was checking some assemblies with micro-scope, I found a lot of tiny bubbles/blisters on the board. They are just little dots if you look
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
Electronics Forum | Tue Mar 14 20:42:24 EDT 2023 | stephendo
In a previous lifetime, we had a selective solder machine where I would see solder splashes in the roof of it. I thought someone might have been putting the solder extremely high. But when it was melting there would be bubbles that burst. The manufac
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