Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef
You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu
Electronics Forum | Mon Jul 01 11:41:39 EDT 2013 | pbarton
Do you have access to an x-ray system? If so you can determine if the solder wetting to the lead along it's length meets the criteria set out in IPC-610. Pete B.
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Fri Feb 23 10:07:32 EST 2001 | jmlasserre
I would like to have some advise or explaination about the IPC610 spec. Page 6-51 and 6-52 concerning the solder stains on gold finguers: On the page 6-51, it's recommended to inspect the gold finguers with the unaided eye, but on the page 6-52, th
Electronics Forum | Thu Jun 27 17:32:35 EDT 2013 | tpost
We recently had a question come up regarding the amount of solder on a flat underside termination ( we referenced Flat Lug Lead in IPC 610). Judging by the photo you can see on the Left is a target solder joint, but on the right is one which had rewo
Electronics Forum | Mon Dec 17 15:11:35 EST 2007 | chef
Blew chunks - thanx for thinking outside the box. Of course there's two sides to every story. Just last week I had a new operator "splash" a couple of boards. Top solder was great, it was all one big solder bridge. Come to find out, the operator forg
Electronics Forum | Mon Jul 16 10:44:29 EDT 2007 | Jacky
Hi All, Recently, we encountered strange defect at our SMT line. We can see solder ball spatter around at one of the component pad. This lead to insufficient solder defect at 1 side of the component. The other side of the component look good(Meet
Electronics Forum | Thu Nov 22 23:46:27 EST 2018 | jaypark
Some PTHs on a board in the product I am building are not filled enough to meet the IPC-610-F requirement(at least 75% vertical fill) . I have no access to the solder source side due to something installed right beneath it. In order to completely
Electronics Forum | Mon Dec 02 12:52:40 EST 2002 | slthomas
We're trying a selective soldering pallet for the first time with mixed reviews. Are solder balls a prevalent problem with this process? Most of them seem to correspond with pallet wall locations....is it too much turbulence from the rotary chip wav
Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas
IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D
