Electronics Forum | Thu Oct 26 11:49:54 EDT 2006 | sms_don
CW, The good news is that you are not trying to use SAC paste with SnPb balls for that would be a void generator due to the ball being liquidous while the SAC paste is still in a flux cleaning stage. Two points to consider: One, voids are not an i
Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders
Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.
Electronics Forum | Tue Apr 19 13:23:33 EDT 2016 | vchauhan
We are using Vicor SMT J-Lead VI Chip which is big component on the bottom side. The manufacturer recommends to have 6 mil stencil but the customer required 10 mil stencil. The PWB has gold contacts on both sides. We noticed some mini solder splashes
Electronics Forum | Mon Jul 29 08:34:40 EDT 2013 | gallionc
I don't see an issue. As was mentioned before, it is what the customer wants. You could approach this from one of two ways. You could simply install the parts, clinch the leads on the opposite side for added mechanical strength and solder the parts
Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar
Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr
Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury
| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s
Electronics Forum | Thu May 19 07:06:59 EDT 2005 | py
have you some GND layer inside the pcb ? see IPC 610 A
Electronics Forum | Fri Aug 28 05:26:05 EDT 2009 | sachu_70
Hi Dave, Would this be different from IPC-610-D. I am not sure.
Electronics Forum | Fri Jan 15 07:23:14 EST 2021 | denism
Also, solder splashes can be due to contamination, for example, on the terminals of components. In the past, had a problem with solder splashes on a seemingly standard SMD component. The reason was the incorrect nickel plating process of the componen
