Electronics Forum | Mon Mar 01 11:56:51 EST 2010 | pjc
Your IPC-610 workmanship manual will have the answer for you (I don't have the latest at my fingertips). Depends on what class you are building too, 1, 2 or 3 and the application of this connector on the product- which you must determine.
Electronics Forum | Fri Aug 19 07:40:24 EDT 2011 | scottp
What do the heel fillets look like and what level of IPC-610 (class 1,2, or 3) are you working to? Do the joints on all 4 sides look bad or just the one side? Do other parts on the board look OK?
Electronics Forum | Fri Sep 23 15:10:45 EDT 2011 | action_101
The IPC-610 class II spec is very reasonable. If they expect class 3 then make them pay for it....IMO
Electronics Forum | Tue Sep 27 14:54:20 EDT 2011 | scottp
That's correct - IPC-610 doesn't tell you whether rework is allowed or not. That's a customer issue.
Electronics Forum | Wed Aug 07 15:58:17 EDT 2024 | SMTA-64386252
Hello. Since a DFN is a BTC component, an end fillet height is not required on IPC 610 since most of these components did not have a wettable surface on the sides. A cross section in a non-touched up sample could be performed to validate the solder
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.
Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T
Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau
RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have
Electronics Forum | Tue Aug 13 09:47:49 EDT 2002 | johnw
Hi Folk's, a quick and easy? question. Got a card with PTH edge stiffeners fitted to it so we need to flow solder them. Having problems getting hole fill, mainly I think due to 2 things, poor pin to hole ratio and also a bit of oxide. The question i
Electronics Forum | Tue Oct 22 15:32:09 EDT 2002 | ruppertg125
We are a military contractor and need to build to IPC610 class3. We are receiving many parts with palladium leads and currently use a No-clean solder paste. We have evaluated OA pastes with very little improvements. Without a touch up of all leads th
