Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Thu Apr 05 09:18:14 EDT 2007 | pjc
Please note that pin holes and blow holes are not always defects. The latest IPC 610A Rev D workmanship standard has them as process indicators- depending on Class. I don't have the document handly while writing this. It would be good to look that up
Electronics Forum | Thu Sep 27 10:53:59 EDT 2007 | gregoryyork
Joris, > > Yep, very common to have those small > blow holes in lead-free alloys. We used to get > them very consistently on white-tin finished > boards, and less frequently with gold finished > boards, for what ever that is worth. > > IPC-6
Electronics Forum | Thu Aug 14 21:58:43 EDT 2008 | proy
NO WAY I had seen this 10 years ago, and got into a 'p' match with the PCB fabricator. We had failures after wave solder, the thermal ezpansion caused cracks in the 'knee' where the skinny little trace go's over into the barrel. even if not failin
Electronics Forum | Fri Dec 07 08:29:26 EST 2012 | juggalo
I agree with you sarason, but just last week the owner of our company walked up to the wave solder while an operator was performing maintenance and the operator threw a bar of solder into the bath and solder splashed into the owners eye. Still no one
Electronics Forum | Wed Jun 18 09:13:44 EDT 2008 | realchunks
You're barking up the wrong tree. Solder "splashes" are generally caused by your print being off pad a bit. They are called solder fines. I've never seen a placement machine have the capability to push paste around using it's kiss-off from the noz
Electronics Forum | Wed Jun 18 11:30:13 EDT 2008 | gemengr
service manual for topaz-xII chapter 15 set vacuum chapter 15-3 to 15-9.
Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane
I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of
Electronics Forum | Fri Apr 06 09:02:20 EDT 2001 | CAL
FYI- Toe Fillets have not been required per IPC 610b/c (they are nice to have though). Remember before Solder paste inspection equipment The Solder powder type/size, stencil type, and apertures are what defined volume. The need has not been until rec
Electronics Forum | Mon Mar 08 05:03:24 EST 2010 | grahamcooper22
Hi, I fully agree with isd.jww. The difference in the solder joint appearance of the 2 joints highlighted could be down to a few reasons...reflow profile (I know you've checked, but have you stuck a thermocouple on this actual joint ? ), contaminatio
