Electronics Forum | Sat Mar 11 08:53:44 EST 2017 | tch
My company is looking for a vacuum that can handle being used to clean up solder splashes on the bottom of our wave solder machines and around the solder pot area in our ERSA Selective Solder Machines. In the past we would use a Shopvac but these don
Electronics Forum | Tue Jun 17 09:24:43 EDT 2008 | rgduval
Could it be from a dirty stencil, rather than from the pick and place operation? We've seen a number of occurences recently with solder balls near some of our fine pitch components...we eventually diagnosed as dirty stencils...excess solder on the b
Electronics Forum | Tue Jan 25 14:25:47 EST 2000 | Mark Miller
Has any one experienced hand soldering through hole components to white tin plated PCB's using no-clean wire solder? Our facility is presently evaluating white tin vs Sn/Pb coatings. Our only difficulty at this time has been hand soldering of wires
Electronics Forum | Thu Dec 10 22:36:03 EST 2020 | solderingpro
I represent PROMATION USA and we have several solutions for solder wire perforation: Our QUICK 372B is a stand-alone drilling station. Our QUICK 371DI is a semi-automatic hand soldering station with perforation technology. Our QUICK 300A/B is a d
Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
Electronics Forum | Mon Feb 20 13:29:44 EST 2006 | patrickbruneel
Great work Amol, Please keep us posted about the results of the x sectioning. I personally don't believe that the cracks are due to non-eutectic properties of SAC. Because the alloy is only 4�C off eutectic and when a solder joint exits the solder
Electronics Forum | Mon Mar 17 07:00:34 EDT 2008 | ectan5117
Hi, During SMT process, i found that solder splash on the gold pad. The distance between the COB pad with component pad is about 1.25mm. My question is what material can used to cover the COB pad without bringing contamination. And i am welcome to
Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one
Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i
Electronics Forum | Thu Jun 24 10:48:02 EDT 1999 | Earl Moon
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh
Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr
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