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Thru-hole Assembly

Thru-hole Assembly

New Equipment | Assembly Services

Rest assured in the quality of your production runs with Accu-sembly's IPC-610D certified hand solderers and inspectors, and electrostatic discharge (ESD) protected assembly floor. Our Thru-hole assembly process allows for your parts to be hand prepp

Accu-sembly, Inc.

PCB PCBA

PCB PCBA

New Equipment |  

PCBA(RoHS-Compliance,Lead free,ODM,OEM,SMT,EMS) We supply OEM and ODM services for PCBA. 1) Surface-mounting Technology (SMT) and Through-hole/DIP 2) 0402,0201 placement 3) BGA,CSP,QFP 4) IC precision: 0.3mm 5) AOI,X-Ray,ICT(In circuit test),FC

Tronixlink PCB PCBA

DGTronik Sp. zo.o.

Industry Directory | Manufacturer

www.dgtronik.com.pl www.dgtronik.co.uk Contract electronic manufacturing. High mix - low/midium volumes, EMS, SMT, THT, testing, PCB, components, realization time 1-3 weeks, IPC-610-D, ISO9001:2008.

Surface Mount Production Manager/Manufacturing Engineer

Career Center | Montrose, California USA | Management,Production,Quality Control

Micro/sys designs and manufactures embedded board level products. We currently have an exciting opportunity for an experienced SMT manufacturing professional. We are looking for an energized individual to take a leadership position managing our prod

Micro/sys, Inc.

Circuit Board, SMT, OEM Turnkey Service

Circuit Board, SMT, OEM Turnkey Service

New Equipment |  

PCBA , Printed Circuit Board Assembly, PCB Assembly , EMS pcba, Electronic Manufacturing OEM PCBA Tronixlink PCB Assembly line includes the latest process in SMT and wave soldering along with SIP, AOI, X-ray, ICT and functional testing. Our SMT capab

Tronixlink PCB PCBA

Hot Bar soldering (FPC to PCB)

Electronics Forum | Fri Aug 28 05:26:05 EDT 2009 | sachu_70

Hi Dave, Would this be different from IPC-610-D. I am not sure.

Info/Papers correlating lead protrusion and reliability

Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT

I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT

LLP Device

Electronics Forum | Wed Mar 08 18:09:52 EST 2006 | jax

Part is most likely a QFN package. IPC-610-D has standards on solder quality for this new type of package.

BGA Voids

Electronics Forum | Thu May 20 21:16:46 EDT 2010 | erli

Hi Pat According IPC-610D voids biger 25% are considered defects. You need verify you Pre Heat and try to reduce the ramp. Its very importante verify if the BGA`s are avoid hummity. Erli

Solder Joint

Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.

Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T

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Blackfox IPC Training & Certification

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