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DGTronik Sp. zo.o.

Industry Directory | Manufacturer

www.dgtronik.com.pl www.dgtronik.co.uk Contract electronic manufacturing. High mix - low/midium volumes, EMS, SMT, THT, testing, PCB, components, realization time 1-3 weeks, IPC-610-D, ISO9001:2008.

Surface Mount Production Manager/Manufacturing Engineer

Career Center | Montrose, California USA | Management,Production,Quality Control

Micro/sys designs and manufactures embedded board level products. We currently have an exciting opportunity for an experienced SMT manufacturing professional. We are looking for an energized individual to take a leadership position managing our prod

Micro/sys, Inc.

Circuit Board, SMT, OEM Turnkey Service

Circuit Board, SMT, OEM Turnkey Service

New Equipment |  

PCBA , Printed Circuit Board Assembly, PCB Assembly , EMS pcba, Electronic Manufacturing OEM PCBA Tronixlink PCB Assembly line includes the latest process in SMT and wave soldering along with SIP, AOI, X-ray, ICT and functional testing. Our SMT capab

Tronixlink PCB PCBA

Hot Bar soldering (FPC to PCB)

Electronics Forum | Fri Aug 28 05:26:05 EDT 2009 | sachu_70

Hi Dave, Would this be different from IPC-610-D. I am not sure.

Info/Papers correlating lead protrusion and reliability

Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT

I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT

LLP Device

Electronics Forum | Wed Mar 08 18:09:52 EST 2006 | jax

Part is most likely a QFN package. IPC-610-D has standards on solder quality for this new type of package.

BGA Voids

Electronics Forum | Thu May 20 21:16:46 EDT 2010 | erli

Hi Pat According IPC-610D voids biger 25% are considered defects. You need verify you Pre Heat and try to reduce the ramp. Its very importante verify if the BGA`s are avoid hummity. Erli

Solder Joint

Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.

Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Mon Feb 20 04:59:40 EST 2006 | Loco

For visual inspection table 1-2 seems to be in order here. If you can not see the bottom using 1.8 and table 1-2, it clearly would be a defect and rework would be the only option Well, my thoughts anyway, wonder if someone has other thoughts on thi

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Sat Feb 18 15:40:45 EST 2006 | Cmiller

Switch to SN100C (no pun intended). I cant help with the SAC 305 issues but we should have a wave with SN100 running very soon. I will let you all know how that goes. Please report back on the x-sectioning and share the results. I have heard some v


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