Electronics Forum | Wed Dec 11 07:05:28 EST 2019 | ameenullakhan
Hi, Below may help you out. per IPC 7093 ( Design and assembly Process Implementation for Bottom Termination Components ),Clause 6.1.5.3 voids on thermal pad up to 50% does not result in loss of thermal performance. Since the void criteria is
Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh
Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi
Industry News | 2021-02-15 14:41:46.0
– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Sparks, Nevada USA | Engineering,Management,Production
Felix Gutierrez Bueno 3906 Dominus Drive, Sparks. NV. 89436 Cel: 775-313-2975 felix.gutierrez23@yahoo.com *SMT Manager * Sr. SMT Process Engineer * Manufacturing Engineer * Maintenance and repair Supervisor * Background Broad Experience serving as:
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smd-solder-mask-defined-and-nsmd-pads_topic1768.html
PCB land pattern soldered BGA? I have seen a describtion in IPC-7093 6.1.3.6 solder mask design. NSMD is better than SMD on QFN solder joint strenth
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
: Principles by Ray Prasad and Practice and IPC 7093 Design and Assembly Process Guidelines for BTCs also co-chaired Ray. This course identifies many of the characteristics that influence the successful implementation of robust and reliable BTC assembly processes
