Electronics Forum | Mon Feb 16 13:03:13 EST 2015 | dyoungquist
A good resource for implementing a BGA assembly process is: IPC-7095C Design and Assembly Process Implementation for BGAs Lots of valuable information in that publication.
Electronics Forum | Fri Mar 27 10:16:33 EDT 2015 | dyoungquist
A good resource for implementing/evaluating a BGA process is IPC-7095C - "Design and Assembly Process Implementation for BGAs". I get no monetary or other compensation for promoting that standard but it is fun to mention that a board assembled by my
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2013-02-20 18:54:10.0
IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html
I.C.T-7900 X-ray , the void rate of some soldered products can be as high as 30%, while according to IPC-7095C, the void rate is greater than 35
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