Full Site - : ipc-a-610 and fill (Page 1 of 48)

Blackfox is now open for remote online and in-person training with a thorough plan to keep students and employees safe

Industry News | 2020-05-27 15:54:35.0

Blackfox is opening its facilities to in-person training for the electronics manufacturing industry with a thorough and documented safety plan for all. If preferred, Blackfox is also offering online IPC training and certification in either English or Spanish from the comfort of your home or office.

Blackfox Training Institute, LLC

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

Workmanship Standards and Instruction for the Soldering & Rework of Through-Hole and Surface Mount Components

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

IPC-A-610 Specialist (CIS) - Training and Certification

IPC-A-610 Specialist (CIS) - Training and Certification

New Equipment | Education/Training

This 3-day, lectured course utilizes the images in the IPC-A-610 inspection document to provide visual accept/reject criteria examples for all three classes of assembly production–in both lead and lead-free. The IPC-A-610, “The Acceptabil

EPTAC Corporation

IPC-A-610 Instructor (CIT) - Training and Certification

IPC-A-610 Instructor (CIT) - Training and Certification

New Equipment | Education/Training

This 4-day, lectured course utilizes the images in the IPC-A-610 document to provide visual accept/reject criteria examples for all three classes of assembly production–for both lead and lead-free. The IPC-A-610, “The Acceptability of Ele

EPTAC Corporation

Inspection Services - Visual and X-Ray

Inspection Services - Visual and X-Ray

New Equipment | Inspection

ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for all IPC inspection standards. Visual Inspection Services ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for a

ACI Technologies, Inc.

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

Automated Desk Dispensing Machine - Efficient and Convenient

Automated Desk Dispensing Machine - Efficient and Convenient

New Equipment | Dispensing

Automated Desk Dispensing Machine - Efficient and Convenient ❙ Introduce of Desk Automatic Dispensing Machine Semiconductor packaging, PCB electronic parts fixation and protection, mobile phone, notebook shell bonding, LCD glass substrate  packag

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing

Technical Library | 2019-06-21 10:39:15.0

Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.

ACI Technologies, Inc.


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