Industry Directory: ipc-a-610 bga void specification (3)

BEST Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center

Omni Training

Industry Directory | Standards Setting / Certification / Training Provider

Omni Training has provided the electronics manufacturing community with a wide range of hands-on solder training services since 1978. Materials and curricula are continuously being updated to address the advancements in electronic

New SMT Equipment: ipc-a-610 bga void specification (13)

IPC Certification & Solder Training

IPC Certification & Solder Training

New Equipment | Education/Training

BEST is an IPC Master Certification Solder Training Center offering Instructor and Operator courses for IPC-A-610, J-STD-001,IPC-A-600, IPC/WHMA 620, IPC 7711/7721 as well as customized classes to meet your specific standard or criteria. Our IPC Trai

BEST Inc.

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

New Equipment | Solder Materials

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC

AIM Solder

Electronics Forum: ipc-a-610 bga void specification (43)

BGA void removal

Electronics Forum | Thu Oct 10 16:13:01 EDT 2002 | slthomas

"Do you work for Air-Vac or what?" My question as well. If so, it is my opinion that there is a need for some house cleaning, because dissing a competitor's product on this forum is gutter-dweller tactics. If not, can you (AJ, not Russ) provide so

BGA void removal

Electronics Forum | Mon Oct 07 13:15:41 EDT 2002 | razorsek

Russ, this post doesn't specificly address your original post but I thought it is relevant to your situation and future production. I have been having problems with voids using Kester's R596L paste. I contacted them for a solution to my problem. T

Industry News: ipc-a-610 bga void specification (54)

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:17:09.0

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Technical Library: ipc-a-610 bga void specification (2)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Technical Library | 2015-01-05 17:38:26.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Rockwell Collins

Videos: ipc-a-610 bga void specification (11)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

SMT PCBA X-ray Machine

SMT PCBA X-ray Machine

Videos

SMT PCBA X-ray Machine ETA-7900 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt x ray,smt x ray machine,x-ray inspection machine,x-ray d

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: ipc-a-610 bga void specification (6)

IPC-A-610 Specialist (CIS) Training Course

Training Courses | | | IPC-A-610 Specialist (CIS)

The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies

Circuit Technology Inc.

IPC-A-610 Certified IPC Trainer (CIT) Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Circuit Technology Inc.

Career Center - Jobs: ipc-a-610 bga void specification (3)

Manufacturing Engineer

Career Center | Rochester, New York USA | Engineering

Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes

Harris RF Communications

SMT Process Engineer

Career Center | Huntington Beach, California USA | Engineering

Trantronics, Inc. A well-established electronics assembly company who specializes in outstanding customer services and on time delivery is seeking a motivated hardworking individual to john our team at the Hunting Beach location. Responsibilities

TRANTRONICS, INC.

Career Center - Resumes: ipc-a-610 bga void specification (4)

qa inspector

Career Center | , California | Quality Control

Tammy T Vo P.O. Box 2213 (714) 254-5073  E-mail: nhutamvo@yahoo.com Position of Interest  Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications  12 years of experience wo

Printed Circuit Assembly Production/Process Engineer

Career Center | tulsa, Oklahoma | Engineering

Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th

Express Newsletter: ipc-a-610 bga void specification (756)

SMTnet Express - January 14, 2016

SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 Now Available: Amendments for J-STD-001F and IPC-A-610F In order to keep up with industry demand, IPC has released

Partner Websites: ipc-a-610 bga void specification (225)

IPC-A-610 Instructor Certification - Online Program | EPTAC

| https://www.eptac.com/etrainings/ipc-a-610-instructor-certification-online/

three classes of assembly production–in both lead and lead-free. The IPC-A-610, “The Acceptability of Electronic Assemblies”, is the most widely used inspection specification for the PWB assembly industry

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis

Heller Industries Inc.


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