Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70
Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef
IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -
Electronics Forum | Wed Dec 11 07:58:38 EST 2019 | clockwatcher
Although this is not technically a bottom termination component, the method of attachment of the thermal pad is a bottom termination attachment. For bottom termination components IPC states that "thermal pad void criteria shall be established between
Electronics Forum | Sun Nov 10 15:36:06 EST 2013 | davef
Assuming your conformal coating material was selected with the intent of living a life in contact with oil, why doesn't your coating meet the IPC-A-610D requirement of that there be no voiding, no breaks in the surface, no loss of adhesion, etc? Furt
Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev
Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61
Electronics Forum | Fri Jul 19 13:02:01 EDT 2019 | davef
Double-check me on this, but I don't believe that A-610 [IPC-A-610] requires side fillets on QFN solder connections, because the sides of most terminations are not plated. Plating on the bottom of the termination is sufficient for a proper solder con
Electronics Forum | Thu Oct 26 18:10:11 EDT 2000 | ptvianc
Philip: Cases 1-3, those criteria may be specified in more recent versions of ANSI/J-STD-001 and/or ANSI/IPC-A-610. Unfortunately, I do not have any new versions of these specs. that may cover these points. As for voids in BGA joints, I have not
Electronics Forum | Fri Aug 25 14:39:24 EDT 2006 | davef
1 When you peel the solder connection of a BGA, * If solder remains on the soldered surface [eg, component, substrate, etc], it's good. * If some solder remains and some base metal is present, it's marginal. * If no solder remains, it's NG. 2 Try I
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