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DRM-PTH-F Through-Hole SolderJoint Evaluation Training & Reference Guide

DRM-PTH-F Through-Hole SolderJoint Evaluation Training & Reference Guide

New Equipment | Education/Training

Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections. With 30 pages and a compact size at 5.5 x 8.5 inch

soldertools.net

IPC-A-610 Rev G Standard

IPC-A-610 Rev G Standard

New Equipment | Inspection

IPC A-610 G Acceptability of Electronic Assemblies. The 610 is the industry standard for the acceptance criteria for assembled PCBs. It is also the instructional book used when teaching IPC-A610 CIS students. Revision  has 440 pages along wit

soldertools.net

FX16 No Clean Liquid Flux

FX16 No Clean Liquid Flux

New Equipment | Solder Materials

FX16 No Clean Flux has been engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, even when unheated. FX16 is ideally formulated for point-to-point selective soldering and palletized wave sold

AIM Solder

FSInspection to Participate in the IPC Hand Soldering Competition at productronica 2015 with the X-Mag Machine Vision Station

Industry News | 2015-11-04 20:46:46.0

FSInspection today announced that it will provide the X-Mag Machine Vision Station in the Hand Soldering Competition presented by IPC — Association Connecting Electronics Industries® in cooperation with productronica 2015. Skilled competitors will demonstrate their soldering skills on Nov. 10–13 in Hall A2, stand 405, as they compete for cash prizes: 1st place — €300; 2nd place — €200; 3rd place — €100; and a coveted spot at the IPC Hand Soldering World Championship at IPC APEX EXPO® in Las Vegas, Nevada on March 15-17, 2016.

FSInspection

DRM-SMT-F Surface Mount Solder Joint Evaluation Training & Reference Guide

DRM-SMT-F Surface Mount Solder Joint Evaluation Training & Reference Guide

New Equipment | Education/Training

Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. With 44 pages and a compact 5.5 x 8.5 inch (14 x

soldertools.net

QFN Side fillet

Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef

IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -

IPC-A-610 interpretation of wetting angle (Chapter5)

Electronics Forum | Fri Oct 13 08:09:41 EDT 2017 | davef

While I wouldn't be happy with this "Hershey's Kiss" appearing solder connection, I'd suck it up and and accept it as acceptable according to IPC-A-610F, Section 5.1

Golden Ground Pad Contamination with Solder

Electronics Forum | Fri Nov 17 11:03:32 EST 2017 | davef

IPC-A-610F, 10.1, Non-Soldered Contact Areas: Has words to the effect that for Class 1, 2, 3; it is defect to have solder or any other contamination in the critical contact area.

QFN Side fillet

Electronics Forum | Mon Jul 22 02:13:31 EDT 2019 | jandon

some PQFN package configurations have no toe exposed or do not have a continous solderable surface on the exposed toe and a toe fillet will not form. (IPC-A-610F 8.3.13)

IPC-A-610 and IPC J-STD-001 Updations

Electronics Forum | Mon Jul 24 09:15:32 EDT 2017 | davef

James: This is not "breaking news." IPC-A-610F, Acceptability of Electronic Assemblies was released in July 2014. Both, ... * IPC-A-610G, Acceptability of Electronic Assemblies * J-STD-001G, Requirements for Soldered Electrical and Electronic Assem


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