New SMT Equipment: ipc1 (1)

Allen-Bradley 1771-DXPS Expander Module

Allen-Bradley 1771-DXPS Expander Module

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: ipc1 (1)

Issues with Immersion silver

Electronics Forum | Fri Aug 11 22:14:59 EDT 2017 | dawson

Hi Adonys, What's ICP 1-3? Do you mean IPC? 1. Excess Plating- no excess, but filled with something which generated in the process of copper plating. 2. Dark Vias - it's oxidized. and the solder mask printing is not aligned. The board is failed. M

Industry News: ipc1 (3)

IPC Issues Call for Participation: Help Shape the Future of Design for Environment Standards

Industry News | 2022-08-26 08:58:41.0

IPC's Design for Excellence (DFX) guidelines document, IPC-2231 provides a framework to establish a design review process for the layout of printed board assemblies. This design review assesses the manufacturability attributes of printed boards, namely design for manufacturing, fabrication, assembly, testability, cost, reliability, environment, and reusability. IPC is aware of the responsibilities that electronics manufacturing companies will soon have to regulatory bodies around the world as well to the environment.

Association Connecting Electronics Industries (IPC)

IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

Industry News | 2019-03-10 20:30:11.0

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:

Association Connecting Electronics Industries (IPC)

Technical Library: ipc1 (1)

Handling of Highly-Moisture Sensitive Components - An Analysis of Low-Humidity Containment and Baking Schedules

Technical Library | 2022-09-12 14:07:47.0

Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.

Alcatel-Lucent

Events Calendar: ipc1 (1)

San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA

Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA

San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA

Surface Mount Technology Association (SMTA)


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