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IPC Standards

IPC Standards

New Equipment | Education/Training

IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics

Association Connecting Electronics Industries (IPC)

IPC Honors Members at IPC Printed Circuits Expo� 2003

Industry News | 2003-04-23 08:39:30.0

For their contributions to IPC and the electronics industry

Association Connecting Electronics Industries (IPC)

Trilogy Technologies

Industry Directory | Manufacturer

We provide Design and Development (IPC-2221 certified), PCB fabrication,PCB assembly (manual and machine) and rework,Cable harness ,Jig fabrication and various customized metal works,Box build and electron-mechanical sub-assembly.

Tab-Routing

Electronics Forum | Wed Feb 22 20:33:25 EST 2006 | davef

Here's your design rules: * IPC-2221 * IPC-2222 Bonus is that they include the works, not just break-away tabs

Thermal Relief

Electronics Forum | Wed Mar 03 09:05:28 EST 2004 | davef

Look to IPC-2221, 9.1.3 Thermal Relief In Conductor Planes

Through holes

Electronics Forum | Thu May 09 00:08:01 EDT 2002 | techment

Could someone provide help regarding IPC's recommendation on Plated Through hole's --- lead to hole ratio. I can't find it in IPC-2221 and IPC-SM-782. Thank you very much

Fudical, where, size, etc

Electronics Forum | Wed Nov 02 20:27:08 EST 2005 | davef

Why stop at fids: * IPC-2221 - Generic Standard On Printed Board Design * IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards

Gold coated spring contacts

Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef

Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas

We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob

PCBA Standards

Electronics Forum | Wed Jul 07 17:47:00 EDT 2004 | davef

For bare board design for test, try: * IPC-2221 - Generic Standard On Printed Board Design * Section standard for the board type [eg, IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards]


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